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GS8170LW36C-300, GS8170LW36C (GS8170LW36C / GS8170LW72C) Late Write SigmaRAM

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Description

GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp .
200 MHz. 333 MHz 1.

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This datasheet PDF includes multiple part numbers: GS8170LW36C-300, GS8170LW36C. Please refer to the document for exact specifications by model.
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Datasheet Specifications

Part number
GS8170LW36C-300, GS8170LW36C
Manufacturer
GSI Technology
File Size
946.36 KB
Datasheet
GS8170LW36C_GSITechnology.pdf
Description
(GS8170LW36C / GS8170LW72C) Late Write SigmaRAM
Note
This datasheet PDF includes multiple part numbers: GS8170LW36C-300, GS8170LW36C.
Please refer to the document for exact specifications by model.

Features

* Late Write mode, Pipelined Read mode
* JEDEC-standard SigmaRAM™ pinout and package
* 1.8 V +150/
* 100 mV core power supply
* 1.8 V CMOS Interface
* ZQ controlled user-selectable output drive strength
* Dual Cycle Deselect
* Burst Read

Applications

* and in Flow Through mode NBT SRAMs SigmaRAM Late Write with Pipelined Read Read A CK Address ADV E1 Bx W DQ CQ Q(A) D(B) Q(C) Q(D) A B C D E Deselect Write B Read C Read D Rev: 2.03 1/2005 5/27 © 2002, GSI Technology, Inc. Datasheet pdf - http://www. DataSheet4U. net/ Specifications cited are

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