GBPC15005T - Single Phase Glass Passivated Silicon Bridge Rectifier

GeneSiC

Datasheet Details

Integrally molded heat sink provides low thermal resistance for maximum heat dissipation.
High surge current capability.
Void-free junction soldering by using vacuum soldering.
Universal 3-way terminals: snap on, wire-around, or P. C board mounting.
High temperature soldering guaranteed: 260⁰C/ 10 seconds at 5 lbs (2.3 kg) tension.
Not ESD Sensitive GBPC-T/W Package Mechanical Data Case: Molded plastic with heat sink integrally mounted in t.

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Published: Feb 3, 2016 |