FEPB16HT Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Dual rectifier construction, positive centertap - Glass passivated chip junctions - Low power loss - Low forward voltage, high current capability - High surge current capability - Superfast recovery times for high efficiency - High temperature soldering in accordance with CECC 802 / Reflow guaranteed 0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88) SEATING PLATE -T- 0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79) 0.095 (2.41) 0.100 (2.54) MECHANICAL DATA Case: JEDEC TO-263AB molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams PIN 1 K - HEATSINK PIN 2 Dimensions are in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. FEPB SYMBOLS 16AT FEPB 16BT FEPB 16CT FEPB 16DT FEPB FEPB 16FT 16GT FEPB 16HT FEPB 16JT UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TC=100°C per leg Maximum instantaneous forward voltage per leg at 8.0A Maximum DC reverse current at rated DC blocking voltage per leg Maximum reverse recovery time (NOTE 1) per leg Typical Junction Capacitance per leg (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to case per leg mounted on heatsink VRRM VRMS VDC I(AV) 50 35 50 100 70 100 150 105 150 200 140 200 300 210 300 400 280 400 500 350 500 600 420...