Description
The product information in this catalog is for reference only.Please request the Engineering Drawing for the most current and accurate design informa.
Features
* 1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs. 10 Signal: 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design that fixes ground plates to both sid
Applications
* The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting. 2mm
2. 5 , 3 mm
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT portion to prevent solder wicking. Note: 2.0mm type and 2.5mm, 3mm type are not mated wi