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DB3 Datasheet - HY ELECTRONIC

SILICON BIDIRECTIONAL DIACS

DB3 Features

* Three way layer two terminal, axial lead , POWER DISSIPATION DO- 41 150 mW DO-35(GLASS) .020 TYP. (0.51) 1.083(27.5) MIN hermetically sealed diacs are designed specifically for triggering thyrisitors .The demonstrate low breakover current. The breakover symmetry is within three volts(DB3,DB

DB3 Datasheet (74.60 KB)

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Datasheet Details

Part number:

DB3

Manufacturer:

HY ELECTRONIC

File Size:

74.60 KB

Description:

Silicon bidirectional diacs.

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DB3 SILICON BIDIRECTIONAL DIACS HY ELECTRONIC

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