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S5870 Si PIN photodiode

S5870 Description

PHOTODIODE Si PIN photodiode S5980, S5981, S5870 Multi-element photodiodes for surface mounting .

S5870 Features

* l Large active area S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s General ratings Parameter Window material Gap bet

S5870 Applications

* l Laser beam axis alignment l Level meters l Pointing devices, etc. S5981 Resin coating 30 10.0/4 elements S5870 10.0/2 elements Unit µm mm s Absolute maximum ratings Parameter Symbol Reverse voltage VR Max. O perating tem perature Topr Storage temperature Tstg S5980 S5981 30 -40 to +100

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Datasheet Details

Part number
S5870
Manufacturer
Hamamatsu Corporation
File Size
322.83 KB
Datasheet
S5870-HamamatsuCorporation.pdf
Description
Si PIN photodiode

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PIN photodiode Hamamatsu Corporation
Hamamatsu Corporation S5870-like datasheet