Description
www.DataSheet4U.com Agilent HMPP-386x Series MiniPak Surface Mount RF PIN Diodes Data Sheet .
Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging.
Features
* Surface mount MiniPak package
* low height, 0.7 mm (0.028") max.
* small footprint, 1.75 mm2 (0.0028␣ inch2)
Applications
* These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is