Description
www.DataSheet4U.com Agilent HMPP-389x Series MiniPak Surface Mount RF PIN Switch Diodes Data Sheet .
Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging.
Features
* Surface mount MiniPak package
* low height, 0.7 mm (0.028") max.
* small footprint, 1.75 mm2 (0.0028 inch2)
Applications
* These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package