HMPP389x Overview
/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when pared to conventional leaded diodes, and lower.
HMPP389x Key Features
- Surface mount MiniPak package
- low height, 0.7 mm (0.028") max
- small footprint, 1.75 mm2 (0.0028 inch2)
- Better thermal conductivity for higher power dissipation Description/