HMPP3890 Datasheet | Hewlett-Packard

.. Agilent HMPP-389x Series Mini Pak Surface Mount RF PIN Switch Diodes Data Sheet Features - Surface mount Mini Pak package - low height, 0.7 mm (0.028") max. - small footprint, 1.75 mm2 (0.0028 inch2) - Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The Mini Pak package offers reduced parasitics when pared to conventional leaded diodes, and lower thermal resistance. Low junction capacitance of the PIN diode chip, bined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. - Single and dual versions - Matched diodes for consistent performance - Low capacitance - Low resistance at low current - Low FIT (Failure in Time) rate- - Six-sigma quality level - For more information, see the Surface Mount Schottky Reliability Data Sheet. Data Shee . Note that Agilent’s manufacturing techniques assure that dice packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match. The HMPP-389T low inductance wide band shunt switch is well suited for applications up to 6 GHz. Pin Connections and Package Marking 3 4 2 1 Product code Date code Package Lead Code Identification (Top View) Single 3 4 3 Anti-parallel 4 3 Parallel 4 3 Shunt Switch Cathode Anode 2 #0 2 #2 2 #5 Anode 1...