HMPP3860 Description
/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration.
HMPP3860 Key Features
- Surface mount MiniPak package
- low height, 0.7 mm (0.028") max
- small footprint, 1.75 mm2 (0.0028␣ inch2)
- Better thermal conductivity for higher power dissipation Description/