HMPP3860 Datasheet | Hewlett-Packard

.. Agilent HMPP-386x Series Mini Pak Surface Mount RF PIN Diodes Data Sheet Features - Surface mount Mini Pak package - low height, 0.7 mm (0.028") max. - small footprint, 1.75 mm2 (0.0028␣ inch2) - Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance with no reverse bias is the driving issue for the designer. The low dielectric relaxation frequency of the HMPP-386x insures that low capacitance can be reached at zero volts reverse bias at frequencies above 1 GHz, making this PIN diode ideal for hand held applications. - Single and dual versions - Matched diodes for consistent performance - Low capacitance at zero volts - Low resistance - Low FIT (Failure in Time) rate- - Six-sigma quality level - For more information, see the Surface Mount Schottky Reliability Data Sheet. Data Shee . Low junction capacitance of the PIN diode chip, bined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. Note that Agilent’s manufacturing techniques assure that dice packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match. Pin Connections and Package Marking 3 4 2 1 Product code Date code Package Lead Code Identification (Top View) Single 3 4 3 Anti-parallel 4 3 Parallel 4 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. 2 #0 2 #2 2...