HMPP3862 Datasheet PDF - Hewlett-Packard (HMPP-386x) MiniPak Surface Mount RF PIN Switch Diodes Specs

HMPP3862 - (HMPP-386x) MiniPak Surface Mount RF PIN Switch Diodes

This page provides the datasheet information for the HMPP3862, a member of the HMPP-3860_Hewlett (HMPP-386x) MiniPak Surface Mount RF PIN Switch Diodes family.

Datasheet Summary

Description

Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology.

The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications.

Features

Surface mount MiniPak package.
low height, 0.7 mm (0.028") max.
small footprint, 1.75 mm2 (0.0028␣ inch2).
Better thermal conductivity for higher power dissipation.

Datasheet Details

Part number	HMPP3862
Manufacturer	Hewlett-Packard
File Size	311.04 KB
Description	(HMPP-386x) MiniPak Surface Mount RF PIN Switch Diodes
Datasheet	HMPP3862 Datasheet
Additional preview pages of the HMPP3862 datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com Agilent HMPP-386x Series MiniPak Surface Mount RF PIN Diodes Data Sheet Features • Surface mount MiniPak package – low height, 0.7 mm (0.028") max. – small footprint, 1.75 mm2 (0.0028␣ inch2) • Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance with no reverse bias is the driving issue for the designer.

Published: Aug 17, 2006 |