H9TQ17ABJTMCUR Datasheet - Hynix Semiconductor

16GB eNAND (x8) / LPDDR3 16Gb(x32)

H9TQ17ABJTMCUR Features

* [ CI-MCP ]

* Operation Temperature - (-25)oC ~ 85oC

* Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ]

* eMMC5.0 compatible (Backward compatible to eMMC4.5)

* Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits -

H9TQ17ABJTMCUR General Description

and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Mar. 2014 1 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) L.

H9TQ17ABJTMCUR Datasheet (3.45 MB)

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Part number:

H9TQ17ABJTMCUR

Manufacturer:

Hynix Semiconductor

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3.45 MB

Description:

16gb enand (x8) / lpddr3 16gb(x32).

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H9TQ17ABJTMCUR 16GB eNAND LPDDR3 16Gbx32 Hynix Semiconductor

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H9TQ17ABJTMCUR Features

H9TQ17ABJTMCUR General Description

Datasheet Details

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