• Part: H9TQ17ABJTMCUR
  • Description: 16GB eNAND (x8) / LPDDR3 16Gb(x32)
  • Manufacturer: SK Hynix
  • Size: 3.45 MB
Download H9TQ17ABJTMCUR Datasheet PDF
SK Hynix
H9TQ17ABJTMCUR
H9TQ17ABJTMCUR is 16GB eNAND (x8) / LPDDR3 16Gb(x32) manufactured by SK Hynix.
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Mar. 2014 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Features [ CI-MCP ] - Operation Temperature - (-25)oC ~ 85oC - Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ] - eMMC5.0 patible (Backward patible to eMMC4.5) - Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock...