H9TQ17ABJTMCUR Datasheet, 16gb(x32) equivalent, Hynix Semiconductor

H9TQ17ABJTMCUR Features

• 16gb(x32) [ CI-MCP ]
• Operation Temperature - (-25)oC ~ 85oC
• Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ]

PDF File Details

Part number:

H9TQ17ABJTMCUR

Manufacturer:

Hynix Semiconductor

File Size:

3.45MB

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📄 Datasheet

Description:

16gb enand (x8) / lpddr3 16gb(x32). and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licens

TAGS

H9TQ17ABJTMCUR

Hynix Semiconductor

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