Datasheet Specifications
- Part number
- HY27UF082G2M
- Manufacturer
- Hynix Semiconductor
- File Size
- 500.13 KB
- Datasheet
- HY27UF082G2M_HynixSemiconductor.pdf
- Description
- (HY27UF(08/16)2G2M) 2Gbit (256Mx8bit/128Mx16bit) NAND Flash Memory
Description
( DataSheet : www.DataSheet4U.com ) Preliminary HY27UF(08/16)2G2M Series 2Gbit (256Mx8bit / 128Mx16bit) NAND Flash Document Title 2Gbit (256Mx8bit /.Features
* 2) Change DC characteristics (Table 9) - Operating Current ICC1 Typ 0.3 Before After 20 15 Max 40 30 ICC2 Typ 20 15 Max 40 30 ICC3 Typ 20 15 Max 40 30 Aug. 19. 2005 Preliminary 3) Correct PKG dimension (TSOP PKG) CP Before After 0.050 0.100 Rev 0.3 / Aug. 2005 2 Preliminary HY27UF(08/16)2G2M SeApplications
* NAND INTERFACE - x8 or x16 bus width. - Multiplexed Address/ Data - Pinout compatibility for all densities STATUS REGISTER ELECTRONIC SIGNATURE - Manufacturer Code - Device Code CHIP ENABLE DON'T CARE OPTION - Simple interface with microcontroller AUTOMATIC PAGE 0 READ AT POWER-UP OPTION - Boot fromHY27UF082G2M Distributors
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