H9DA4GH4JJAMCR Datasheet - Hynix

NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

H9DA4GH4JJAMCR Features

* [ MCP ]

* Operation Temperature - -30oC ~ 85oC

* Packcage - 137-ball FBGA - 10.5x13.0mm2, 1.2t, 0.8mm pitch - Lead & Halogen Free [ NAND Flash ]

* Multiplane Architecture

* Supply Voltage - Vcc = 1.7 - 1.95 V

* Memory Cell Array - (1K + 32) words x 64 pages x 4096 blocks

* Pa

H9DA4GH4JJAMCR General Description

and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Mar. 2011 1 datasheet pdf - http://www.DataSheet4U.net/ H9DA4GH4JJAMCR series NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS) Document Title MCP 4Gb (.

H9DA4GH4JJAMCR Datasheet (4.02 MB)

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Part number:

H9DA4GH4JJAMCR

Manufacturer:

Hynix

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4.02 MB

Description:

Nand 4gb(x16) / mobile ddr 4gb(x32 2cs).
MCP Specification 4Gb (256Mb x16) NAND Flash + 4Gb (64Mb x32 2/CS 2CKE) mobile DDR http://www.DataSheet4U.net/ This document is a general product des.

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H9DA4GH4JJAMCR NAND 4Gbx16 mobile DDR 4Gbx32 2CS Hynix

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H9DA4GH4JJAMCR Features

H9DA4GH4JJAMCR General Description

Datasheet Details

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