H9DA4GH4JJAMCR NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

Hynix

Description

MCP Specification 4Gb (256Mb x16) NAND Flash + 4Gb (64Mb x32 2/CS 2CKE) mobile DDR http://www.DataSheet4U.net/ This document is a general product des.
and is subject to change without notice.

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Datasheet Specifications

Part number: H9DA4GH4JJAMCR
Manufacturer: Hynix
File Size: 4.02 MB
Datasheet: H9DA4GH4JJAMCR_Hynix.pdf
Description: NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

Features

* [ MCP ]
* Operation Temperature - -30oC ~ 85oC
* Packcage - 137-ball FBGA - 10.5x13.0mm2, 1.2t, 0.8mm pitch - Lead & Halogen Free [ NAND Flash ]
* Multiplane Architecture
* Supply Voltage - Vcc = 1.7 - 1.95 V
* Memory Cell Array - (1K + 32) words x 64 pages x 4096 blocks
* Pa

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