FF08MR12W1MA1_B11A Datasheet - Infineon

FF08MR12W1MA1_B11A a half bridge module

The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which combines the benefits of Infineon’s robust silicon carbide technology with a very compact and flexible package for hybrid and (fuel cell) electric vehicles. The power module implements the new CoolSiCTM Automotive MOSFET 1200V Gen1,.

FF08MR12W1MA1_B11A Features

* Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C

* Mechanical features - 5.1 kV DC 1 second Insulation - Compact d

FF08MR12W1MA1_B11A-Infineon.pdf