FF08MR12W1MA1_B11A - a half bridge module

Infineon

FF08MR12W1MA1_B11A Datasheet Preview — Preview of FF08MR12W1MA1_B11A PDF

Datasheet Details

Part number	FF08MR12W1MA1_B11A
Manufacturer	Infineon ↗
File Size	587.85 KB
Description	a half bridge module
Datasheet	FF08MR12W1MA1_B11A-Infineon.pdf

FF08MR12W1MA1_B11A Product details

Description

The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which combines the benefits of Infineon’s robust silicon carbide technology with a very compact and flexible package for hybrid and (fuel cell) electric vehicles.

Features

Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C.
Mechanical features - 5.1 kV DC 1 second Insulation - Compact design - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant Potential.

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Published: May 5, 2025 |