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FF08MR12W1MA1_B11A a half bridge module

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Description

FF08MR12W1MA1_B11A EasyPACK™ module EasyPACK™ module with CoolSiC™ Automotive MOSFET and PressFIT / NTC .
The Automotive CoolSiCTM EasyPACKTM1B is a half bridge module which combines the benefits of Infineon’s robust silicon carbide technology with a very.

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Features

* Electrical features - VDSS = 1200 V - IDN = 150 A - New semiconductor material - silicon carbide - Blocking voltage 1200 V - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 150°C
* Mechanical features - 5.1 kV DC 1 second Insulation - Compact d

Applications

* Automotive applications
* Auxiliary inverters
* DC/DC converter
* (Hybrid) electrical vehicles (H)EV Product validation

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FF08MR12W1MA1_B11A half bridge module Infineon
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