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SIDC59D170H Fast switching diode

SIDC59D170H Description

SIDC59D170H Fast switching diode chip in EMCON 3 -Technology .
AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prü.

SIDC59D170H Features

* A
* 1700V EMCON 3 technology 200 µm chip This chip is used for:
* soft, fast switching
* EUPEC power modules
* low reverse recovery charge

SIDC59D170H Applications

* C
* resonant applications, drives Chip Type SIDC59D170H VR IF Die Size 1700V 100A 7.7 x 7.7 mm2 Package Ordering Code sawn on foil Q67050-A4176A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafe

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