SIGC158T170R3E Datasheet - Infineon

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SIGC158T170R3E Features

* 1700V Trench & Field Stop technology

* low turn-off losses

* short tail current

* positive temperature coefficient

* easy paralleling This chip is used for:

* power modules Applications:

* drives Chip Type VCE IC Die Size SIGC158T170R3E 1700V 125A 12.57 x 12.57 m

SIGC158T170R3E General Description

AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Version 2.1 2.2 Subjects (major changes since last revision) Change wafer size to 200 mm Additional basic types L7801M, L7801T, L7801E Published by Infi.

SIGC158T170R3E Datasheet (161.63 KB)