Datasheet Details
Part number:
SIGC158T170R3E
Manufacturer:
File Size:
161.63 KB
Description:
IGBT
Features
* 1700V Trench & Field Stop technology
* low turn-off losses
* short tail current
* positive temperature coefficient
* easy paralleling This chip is used for:
* power modules Applications:
* drives Chip Type VCE IC Die Size SIGC158T170R3E 1700V 125A 12.57 x 12.57 m
SIGC158T170R3E, IGBT
AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Version 2.1 2.2 Subjects (major changes since last revision) Change wafer size to 200 mm Additional basic types L7801M, L7801T, L7801E Published by Infi
SIGC158T170R3E Distributor
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