Datasheet Details
Part number:
80386SXSA
Manufacturer:
Intel
File Size:
248.36 KB
Description:
Embedded Microprocessor
Features
* e junction temperature (TJ). See Figures 3 and Figures 4 for case and ambient temperature relationships to frequency. A packaged device produces thermal resistance between junction andApplications
* Figure 3 and Figure 4 illustrate the flexibility of low power devices with respect to temperature and frequency relationships. w w w Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringe-ment of any patent or cDatasheet Details
Part number:
80386SXSA
Manufacturer:
Intel
File Size:
248.36 KB
Description:
Embedded Microprocessor
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