Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI suppression effect but least impact to data signal wave
✔ WCM-2012-261T Application
Preventive measure against high speed signal radiation emissions such as USB 2.0, IEEE1394 or LAN interface.
WCM-2012-201T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-221T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-240T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-120T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-121T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-141T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-161T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-181T, KING CORE
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
