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SC7777D - hybrid IC

Datasheet Summary

Features

  • Adjustment processes are decreased by function and ratio trimmings.
  • High density mounting by bonding (COB).
  • Various types of package are available.
  • High reliability achieved by KOA’s original thick film technology.
  • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information.

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Datasheet Details

Part number SC7777D
Manufacturer KOA Speer Electronics
File Size 92.05 KB
Description hybrid IC
Datasheet download datasheet SC7777D Datasheet
Additional preview pages of the SC7777D datasheet.

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KA, SC www.DataSheet4U.com hybrid IC EU NEW features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information N New Part # KA Product Code KA: Hybrid IC SC: Non-Noble 7777 KOA Ref.
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