SC7777T Features
* Adjustment processes are decreased by function and ratio trimmings
* High density mounting by bonding (COB)
* Various types of package are available
* High reliability achieved by KOA’s original thick film technology
* Thick film printed circuit substrate ap
SC7777D_KOASpeerElectronics.pdf
Datasheet Details
SC7777T, SC7777D
KOA Speer Electronics
92.05 KB
Hybrid ic.
This datasheet PDF includes multiple part numbers: SC7777T, SC7777D.
Please refer to the document for exact specifications by model.
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