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SC7777D hybrid IC

SC7777D Description

KA, SC www.DataSheet4U.com hybrid IC EU NEW .

SC7777D Features

* Adjustment processes are decreased by function and ratio trimmings
* High density mounting by bonding (COB)
* Various types of package are available
* High reliability achieved by KOA’s original thick film technology
* Thick film printed circuit substrate ap

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Preview of SC7777D PDF

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hybrid KOA Speer Electronics
KOA Speer Electronics SC7777D-like datasheet