MK71050-03 - Low Energy wireless module

LAPIS Semiconductor

MK71050-03 Datasheet Preview — Preview of MK71050-03 PDF

Datasheet Details

Part number	MK71050-03
Manufacturer	LAPIS Semiconductor
File Size	596.01 KB
Description	Low Energy wireless module
Datasheet	MK71050-03-LAPISSemiconductor.pdf

MK71050-03 Product details

Description

.） 2 NC --- --- --- No connection（※Refer to PIN descriptions.） 3-4 ANT_GND --- --- --- Antenna GND（※Refer to PIN descriptions.） 5 NC --- --- --- No connection（※Refer to PIN descriptions.） 6 OUT_ANT INOUT ANA --- Output from Antenna (to be connected to OUT_MOD by user's PCB) 7 OUT_MOD INOUT ANA --- Output from Module (to be connected to OUT_ANT by user's PCB) 8 GND --- GND GND GND 9 VDDCORE --- PWR VCC Internally generated power supply, 10 VDDBAT --- PWR VCC Power su

Features

>.
Bluetooth® SIG Core Spec v4.0 compliant.
Radio certification MIC JAPAN(certification no:006-000238） FCC（FCC ID:2ACIJ71050-3） CE（R&TTE）.
Bluetooth® Qualification（End Product、QDID:66491）.
Integrating ML7105C-001 Bluetooth® LE single mode LSI.
Integrating 26MHz xtal oscillator.
Integrating 128kbit EEPROM.
Single power supply 1.8V to 3.6V.
Operating Temperature -20 deg. C to 70 deg. C.
Current Consumptions Deep.

📁 MK71050-03 Similar Datasheet

MK712 - Touch Screen Controller (Integrated Circuit Systems)
MK71251-01 - Bluetooth Smart wireless module (LAPIS)
MK71251-02 - Bluetooth Smart wireless module (LAPIS)
MK715 - Touch Screen Controller (Integrated Circuit Systems)
MK74CB115 - 1 to 16 Buffalo Clock Driver (Integrated Circuit Systems)
MK74CB163 - 1 to 16 PECL to CMOS Buffalo Clock Driver (Integrated Circuit Systems)
MK74CB214 - Dual 1 to 7 Buffalo Clock Driver (Integrated Circuit Systems)
MK74CB217 - Dual 1 to 8 Buffalo Clock Driver (Integrated Circuit Systems)

Other Datasheets by LAPIS Semiconductor

Published: Feb 19, 2016 |