Description
Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP .
General Description
Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP.
Features
* NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family
Current production part numbers: See Table 1 on page 3
Features
Figure 1:
PoP Block Diagram
* Micron® NAND Flash and Mobile LPDRAM components
* RoHS-compliant, “green” packa
Applications
* with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio. The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control,