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MBRB2535CTL Power Rectifier

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Description

MOTOROLA Designer's SEMICONDUCTOR TECHNICAL DATA Order this document by MBRB2535CTL/D ™ Data Sheet SWITCHMODE™ Power D2PAK Surface Mount Power Pac.

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Datasheet Specifications

Part number
MBRB2535CTL
Manufacturer
Motorola
File Size
105.67 KB
Datasheet
MBRB2535CTL_MotorolaInc.pdf
Description
Power Rectifier

Features

* epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. These state
* of
* the
* art devices have the following features:

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface 0.70 17.78 between the board and the package. With the correct pad geometry, the packages will self align when sub

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