Datasheet Specifications
- Part number
- MBRB2535CTL
- Manufacturer
- Motorola
- File Size
- 105.67 KB
- Datasheet
- MBRB2535CTL_MotorolaInc.pdf
- Description
- Power Rectifier
Description
MOTOROLA Designer's SEMICONDUCTOR TECHNICAL DATA Order this document by MBRB2535CTL/D ™ Data Sheet SWITCHMODE™ Power D2PAK Surface Mount Power Pac.Features
* epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. These stateApplications
* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface 0.70 17.78 between the board and the package. With the correct pad geometry, the packages will self align when subMBRB2535CTL Distributors
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