* package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 500 milliwatts. There are other alternatives to achieving higher power dissipation from the TSOP
* 6 package. Another alternative would be to use a ceramic substrate or
MGSF3454XT1 Datasheet (138.16 KB)
MGSF3454XT1
Motorola
138.16 KB
N-channel enhancement-mode tmos mosfet.
MOTOROLA SEMICONDUCTOR TECHNICAL DATA ™ Order this document by MGSF3454XT1/D Preliminary Information MGSF3454XT1 Motorola Preferred Device Low rD.
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