* n of the SOT
* 23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die,
MMBTA20LT1 Datasheet (413.36 KB)
MMBTA20LT1
Motorola
413.36 KB
General purpose amplifier.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MMBTA20LT1/D
General Purpose Amplifier
NPN Silicon
COLLECTOR 3 1 BASE
MMBTA20LT1
3 1
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