Datasheet Details
- Part number
- MMBTA20LT1
- Manufacturer
- Motorola
- File Size
- 413.36 KB
- Datasheet
- MMBTA20LT1_MotorolaInc.pdf
- Description
- General Purpose Amplifier
MMBTA20LT1 Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBTA20LT1/D General Purpose Amplifier NPN Silicon COLLECTOR 3 1 BASE MMBTA20LT1 3 1 .
MMBTA20LT1 Features
* n of the SOT
* 23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die,
MMBTA20LT1 Applications
* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a
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