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MMBTA20LT1 General Purpose Amplifier

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Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBTA20LT1/D General Purpose Amplifier NPN Silicon COLLECTOR 3 1 BASE MMBTA20LT1 3 1 .

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Datasheet Specifications

Part number
MMBTA20LT1
Manufacturer
Motorola
File Size
413.36 KB
Datasheet
MMBTA20LT1_MotorolaInc.pdf
Description
General Purpose Amplifier

Features

* n of the SOT
* 23 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die,

Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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