Part number:
NEZX334Z5.5VV11.5X13F
Manufacturer:
NIC
File Size:
209.25 KB
Description:
Memory back-up capacitors.
* DOUBLE LAYER CAPACITOR
* THIN PROFILE PACKAGE
* SUITABLE FOR FLOW SOLDERING
* LEAD-FREE FINISH CHARACTERISTICS Rated Voltage Range Rated Capacitance Range Operating Temp. Range Capacitance Tolerance Load Life Test @ 70°C 1,000 hours Temperature Characteristics -25°C
NEZX334Z5.5VV11.5X13F Datasheet (209.25 KB)
NEZX334Z5.5VV11.5X13F
NIC
209.25 KB
Memory back-up capacitors.
📁 Related Datasheet
NEZX334Z5.5VH11.5X5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX104Z5.5VH11.5X5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX104Z5.5VV11.5X13F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX105Z5.5VV19X20.5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX155Z5.5VV19X20.5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX224Z5.5VH11.5X5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX224Z5.5VV11.5X13F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.
NEZX473Z5.5VH11.5X5F - Memory Back-Up Capacitors
(NIC)
Memory Back-Up Capacitors
FEATURES • DOUBLE LAYER CAPACITOR • THIN PROFILE PACKAGE • SUITABLE FOR FLOW SOLDERING • LEAD-FREE FINISH CHARACTERISTICS
Ra.