SOT263 Datasheet (NXP) - Package outline

SOT263, Package outline

PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 SOT263 E P A A1 q D1 D mounting base L3 m L L2 L1 Q 1 e b 5 w M c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.7 e 1.7 L 15.0 13.5 L1 (1) L2 (2) L3 max.

3.5 (3) m 0.8 0.6 P 3.8 3.6 q 3.0 2.7 Q 2.6 2.2 w 0.4 2.4 1.6 0.5 Notes 1.

Terminal d