NIS3001 Datasheet - ON Semiconductor

NIS3001 Integrated Driver and MOSFET Power Chip

Pad # 1 2, 19 3 4 5, 6 7 *11, 14, 18 12, 13 15, 16 17 20, 21 Symbol CO GND EN VS PGND DRN Description Logic level control input produces complementary output states. Signal ground. Logic level enable input forces internal driver top gate and bottom gate low, and supply current to less than 1.

www.DataSheet4U.com NIS3001 Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001 is an integrated multi chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are packaged in a power QFN package called PInPAK™. The 10.5 by 10.5 mm PInPAK™ package increases power density and simplifies PCB layout. The device can be used in single or multi phase applic.

NIS3001 Features

* http://onsemi.com MARKING DIAGRAM CASE 500 PInPAK 10.5x10.5 PLLP NIS3001QP AWLYYWW NIS3001 = Specific Device Code A = Assembly Site WL = Wafer Lot YY = Year WW = Work Week PINOUT DIAGRAM 14 15 16 17 11 12 13 18 19 20 10 7 5 9 8 21 1 2 3 4 DataShee

NIS3001_ONSemiconductor.pdf