HVC190 Datasheet - Renesas Technology

Features

* Low capacitance. (C = 0.35 pF max)

* Low forward resistance. (rf = 3.0 Ω typ)

* Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Ordering Information Type No. HVC190 Laser Mark H9 Package Code UFP Pin Arrangement Cathode mark Mark 1 H9 2 1. Cath