R8C/22 Group, R8C/23 Group RENESAS MCU REJ03B0097-0200 Rev.2.00 Aug 20, 2008 1.
Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP.
This MCU operates using sophisticated instructions featuring a high level of instruction efficiency.
With 1 Mbyte of address space, it is capable of executing instructions at high speed.
This MCU is equipped with one CAN module and suited to in-vehicle or FA network
