Description
Correct typo information Update Update IO Ground information Updated section “Package Thermal Characteristics” Initial released
Copyright 2020 © Fuzhou Rockchip Electronics Co., Ltd.-2-
RK3328 Datasheet
Rev 1.4
Table of Content
Table of Content 3 Figure Index 4 Table Index5 NOTICE 6
Chapter 1 Introduction 7
1.1 Overview 7 1.2
Features
- 7 1.3 Block Diagram 15
Chapter 2 Package Information16
2.1 Order Information 16 2.2 Top Marking 16 2.3 TFBGA395L Dimension 16 2.4 Ball Map 19 2.5 Pin Number Order 21 2.6 Power/Ground IO.