Part number:
DIP18
Manufacturer:
File Size:
38.65 KB
Description:
Lsi assembly.
DIP18
LSI Assembly
( Units : mm )
* DIP18
22.9±0.3 18 10
1
9 7.62
3.95±0.3
0.51Min.
6.5±0.3
0.3±0.1
3.29±0.2
2.54
0.5±0.1
0° ~ 15°
.
DIP18
38.65 KB
Lsi assembly.
DIP18
LSI Assembly
( Units : mm )
* DIP18
22.9±0.3 18 10
1
9 7.62
3.95±0.3
0.51Min.
6.5±0.3
0.3±0.1
3.29±0.2
2.54
0.5±0.1
0° ~ 15°
.
📁 Related Datasheet
DIP12-1Axx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
DIP12-1Bxx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
DIP12-1Cxx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
DIP12-2Axx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
DIP14 - DIP-14
(Saga)
..
DIP-14
SAGA ELECTRONICS Co.,LTD
19.0 ±0.3
14
8
6.4 ± 0.2
1 1.5 ±0.2 2.03MA X
7
7.62
3.95 ± 0.3 2.8MIN 3.4 ±0 .2 0.58 ±0 .3
.
DIP14-8 - Metal Dual Inline Package
(RFM)
DIP14-8 Case
Metal Dual-Inline Package with 8-Pin DIP in a 14-Pin Configuration
..
Dimension A B C D E F G H K L M N R Min — — — 0.4.
DIP15-1Axx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
DIP15-1Bxx-xx - (DIP Series) Molded DIP Reed Relays
(MEDER)
..
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very pact design having a low profile pac.
