RM009 - Power Amplifier Module

RM009 Datasheet Preview — Preview of RM009 PDF

Datasheet Details

Part number	RM009
Manufacturer	SKYWORKS
File Size	340.55 KB
Description	Power Amplifier Module
Datasheet	RM009_SKYWORKS.pdf

RM009 Product details

Description

www.DataSheet4U.com Package Dimensions and Pin Descriptions Figure 2 is a mechanical diagram of the pad layout for the 16-pin leadless, RM009 Power Amplifier module.Figure 3 shows the device pin configuration and the pin numbering convention, which starts with pin 1 in the upper left and increments counter-clockwise around the package.Pin assignments and their functional descriptions are listed in Table 4. Figure 4 shows typical case markings.Figure 2. RM009 PAM Package Dimensions

Features

form factor for Class 4 GSM900 and Class 1 DCS1800 cellular handsets.
High efficiency GSM 54% DCS 45% Input/output matching 50 Ω internal Small outline 9.1 mm x 11.6 mm Low profile 1.50 mm ±10% Low APC current 60 µA The module consists a GSM900 PA block and a DCS1800 PA block, matching circuitry for 50 Ω input and output impedances, and bias control circuitry. Two separate Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated on a single Gallium Arsenide (GaAs) die. One PA.

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Published: Feb 16, 2009 |