PLCC20 Datasheet - ST Microelectronics

PLCC20 PLCC 20

® Thermal Data PLCC 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3.6 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data Rth(j-a) (ºC/W) 180 die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils PLCC 2.

PLCC20_STMicroelectronics.pdf