Datasheet Details
- Part number
- QFP-EP
- Manufacturer
- STATS ChipPAC
- File Size
- 238.22 KB
- Datasheet
- QFP-EP_STATSChipPAC.pdf
- Description
- Exposed Pad Quad Flat Pack
QFP-EP Description
www.DataSheet4U.com QFP-ep Exposed Pad Quad Flat Pack * 7 x 7mm to 24 x 24mm body sizes * 32 to 216 lead count * Lead pitch r.
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.
QFP-EP Features
* Body Sizes: 7 x 7mm to 24 x 24mm
* Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
* Lead Counts: 32L to 216L
* Lead Pitch: 0.40mm to 0.80mm
* Wide range of open tool leadframe and die pad sizes available
* JEDEC standard compliant
* Lead
QFP-EP Applications
* ASIC
* DSP
* Gate Array
* Logic, Microprocessors/Controllers
* Multimedia, PC Chipsets, Others
DataSheet 4 U . com
www. statschippac. com
www. DataSheet4U. com
QFP-ep
Exposed Pad Quad Flat Pack
SPECIFICATIONS
Die Thickness Gold Wire Lead Finish Marking Packin
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