Datasheet Details
- Part number
- QFP-SD
- Manufacturer
- STATS ChipPAC
- File Size
- 647.87 KB
- Datasheet
- QFP-SD_STATSChipPAC.pdf
- Description
- Stacked Die Quad Flat Pack
QFP-SD Description
www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack * Stacking of die enables more functionality and integration in a conventional QFP pack.
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.
QFP-SD Features
* Combining devices into one package reduces PCB real estate and cost
* Increased sub-system performance by integrating multiple chips into a single package
* Die to die bonding capability for device/signal integration
* Standard and green/lead-free materials and Pb-f
QFP-SD Applications
* Stacked Die QFP packages are currently available in LQFP, LQFP-ep and TQFP-ep configurations, and are offered in standard and green/lead-free bill of materials. APPLICATIONS
Suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital),
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