H32N65DM6 - N-channel Power MOSFET
This device combines two MOSFETs in a half-bridge topology.
The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly.
Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad.
The
H32N65DM6 Features
* Order code SH32N65DM6AG VDS 650 V RDS(on) max. 97 mΩ ID 32 A
* AQG 324 qualified
* Half-bridge power module
* 650 V blocking voltage
* Fast recovery body diode
* Very low switching energies
* Low package inductance
* Dice on direct bond cop
