SP8255
FEATURES
Super high dense cell design for low RDS(ON). Rugged and reliable. Suface Mount Package. ESD Protected.
DFN 2X5 D1/D2
G2 S2 S2
G1 S1S1
(Bottom view)
G1 3 S1 2 S1 1
Bottom Drain Contact
4 G2 5 S2 6 S2
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise noted)
Symbol Parameter
VDS Drain-Source Voltage
VGS Gate-Source Voltage
Drain Current-Continuous a c
TA=25°C TA=70°C
IDM -Pulsed c
Maximum Power Dissipation a
TA=25°C TA=70°C
TJ, TSTG
Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
R JC
Thermal Resistance, Junction-to-Case
Limit 20 ±12 7 5.6 34 1.67 1.07
-55 to 150
75 5.5
Units V V A A A W W
°C
°C/W °C/W
Details are...
