K4B1G0846D Datasheet, Specification, Samsung semiconductor

K4B1G0846D Features

• Specification 5 3.0 Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 6 3.2 x8 Package Pinout (Top view)

PDF File Details

Part number:

K4B1G0846D

Manufacturer:

Samsung semiconductor

File Size:

1.24MB

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📄 Datasheet

Description:

1gb d-die ddr3 sdram specification. 11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 13 6.1 Absolute Maximum DC Ratings 13 6.2 DRAM Component Operating T

K4B1G0846D Application

• Applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governm

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K4B1G0846D

Samsung semiconductor

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