K4B1G0846D Datasheet - Samsung semiconductor

K4B1G0846D 1Gb D-die DDR3 SDRAM Specification

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 13 6.1 Absolute Maximum DC Ratings 13 6.2 DRAM Component Operating Temperature Range 13 7.0 AC & DC Operating Conditions 13 7.1 Recommended DC operating Conditions (SSTL_1.5) 13 8.0 AC & DC Input Measurement Levels 14 8.1 AC and DC.

K4B1G04(08/16)46D 1Gb DDR3 SDRAM 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Lead-Free & Halogen-Free (RoHS Compliant) CAUTION : This document includes some items still under discussion in JEDEC. Therefore, those may be changed without pre-notice based on JEDEC progress. And it’s highly recommended not to send the spec without Samsung’s permission. INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. N.

K4B1G0846D Features

* 5 3.0 Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 6 3.2 x8 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 7 3.3 x16 Package Pinout (Top view) : 100ball FBGA Pack

K4B1G0846D Datasheet (1.24 MB)