Description
11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 13 6.1 Absolute Maximum DC Ratings 13 6.2 DRAM Component Operating Temperature Range 13 7.0 AC & DC Operating Conditions 13 7.1 Recommended DC operating Conditions (SSTL_1.5) 13 8.0 AC & DC Input Measurement Levels 14 8.1 AC and DC Logic input levels for single-ended signals 14 8.2 VREF Tolerances 15 8.3 AC and DC Logic Input Levels for Ditterential Signals 16 8.3.1 Differential signal definition 16 8.3.2 Differential swing
Features
- 5 3.0 Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 6 3.2 x8 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 7 3.3 x16 Package Pinout (Top view) : 100ball FBGA Package(96balls + 4 balls of support balls) 8 3.4 FBGA Package Dimension (x4/x8) 9 3.5 FBGA Package Dimension (x16) 10 4.0 Input/Output Functional.