K4B1G0446F Datasheet PDF - Samsung 1Gb F-die DDR3 SDRAM Specs

K4B1G0446F - 1Gb F-die DDR3 SDRAM

Datasheet Summary

Description

9 5.

DDR3 SDRAM Addressing 10 6.

Absolute Maximum Ratings 11 6.1 Absolute Maximum DC Ratings 11 6.2 DRAM Component Operating Temperature Range 11 7.

Features

5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 78ball FBGA Package 6 3.2 x8 Package Pinout (Top view) : 78ball FBGA Package 7 3.3 FBGA Package Dimension (x4/x8) 8 4. Input/Output Functional.

Datasheet Details

Part number	K4B1G0446F
Manufacturer	Samsung
File Size	867.49 KB
Description	1Gb F-die DDR3 SDRAM
Datasheet	K4B1G0446F Datasheet
Additional preview pages of the K4B1G0446F datasheet.

📁 Similar Datasheet

K4B1G0446C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)

K4B1G0446D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)

K4B1G0846C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)

K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)

K4B1G1646C - 1Gb C-die DDR3 SDRAM (Samsung semiconductor)

K4B1G1646D - 1Gb D-die DDR3 SDRAM Specification (Samsung semiconductor)

K4B2G0446D - 2Gb D-die DDR3 SDRAM (Samsung semiconductor)

K4B2G0846D - 2Gb D-die DDR3 SDRAM (Samsung semiconductor)

K4B2G1646C - 2Gb C-die DDR3 SDRAM (Samsung semiconductor)

Full PDF Text Transcription

Click to expand full text

Rev. 1.21, Nov. 2010 K4B1G0446F K4B1G0846F 1Gb F-die DDR3 SDRAM 78FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

Published: Oct 9, 2014 |