* 3.0 PACKAGE CONFIGURATIONS 7 3.1 153 Ball Pin Configuration 7 3.2 169 Ball Pin Configuration 8 3.2.1 11.5mm x 13mm x 1.0mm Package Dimension 9 3.2.2 12mm x 16mm x 1.0mm Package Dimension 9 3.2.3 12mm x 16mm x 1.2mm Package Dimension 10 3.3 Product Architecture 11 4.0 e.MMC 4.41 features 12 4.1 D
KLM4G1YE4C-B001 Datasheet (573.57 KB)
KLM4G1YE4C-B001
Samsung
573.57 KB
Embedded mmc solution.
SAMSUNG CONFIDENTIAL Rev. 1.1, Jul. 2012 KLMxGxxE4x-x001 Samsung e MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELE.
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