* 4 3.0 PACKAGE CONFIGURATIONS 5 3.1 153 Ball Pin Configuration 5 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension 6 3.2 Product Architecture 7 4.0 e.MMC 5.0 feature 8 4.1 HS400 mode 8 5.0 Technical Notes 9 5.1 S/W Algorithm 9 5.1.1 Partition Management 9 5.1.1.1 Boot Area Partition and RPMB Area
KLM4G1FEPD-B031 Datasheet (471.14 KB)
KLM4G1FEPD-B031
Samsung
471.14 KB
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KLM4G1FEPD-B031
Samsung eMMC Product family
eMMC 5.0 Specification compatibility
datasheet
SAMSUNG ELECTRONIC.
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