* 4 3.0 PACKAGE CONFIGURATIONS 5 3.1 153 Ball Pin Configuration 5 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension 6 3.2 Product Architecture 7 4.0 e.MMC 5.0 feature 8 4.1 HS400 mode 8 5.0 Technical Notes 10 5.1 S/W Agorithm 10 5.1.1 Partition Management 10 5.1.1.1 Boot Area Partition and RPMB Are
KLM8G1WEMB-B031 Datasheet (329.01 KB)
KLM8G1WEMB-B031
Samsung
329.01 KB
Emmc.
SAMSUNG CONFIDENTIAL Rev. 1.0 Aug. 2013 KLMxGxxEMx-B031 Samsung e MMC Product family e.MMC 5.0 Specification compatibility datasheet SAMSUNG ELECT.
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