KLM8G1WEMB-B031 Datasheet - Samsung

KLM8G1WEMB-B031 eMMC

SAMSUNG CONFIDENTIAL Rev. 1.0 Aug. 2013 KLMxGxxEMx-B031 Samsung e MMC Product family e.MMC 5.0 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive .

KLM8G1WEMB-B031 Features

* 4 3.0 PACKAGE CONFIGURATIONS 5 3.1 153 Ball Pin Configuration 5 3.1.1 11.5mm x 13mm x 0.8mm Package Dimension 6 3.2 Product Architecture 7 4.0 e.MMC 5.0 feature 8 4.1 HS400 mode 8 5.0 Technical Notes 10 5.1 S/W Agorithm 10 5.1.1 Partition Management 10 5.1.1.1 Boot Area Partition and RPMB Are

KLM8G1WEMB-B031 Datasheet (329.01 KB)