Description
KLMxGxxEHx Preliminary SAMSUNG moviNANDTM KLMxGxxEHx (FN3x based moviNAND) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS.
Features
* 4 3.0 Package Configurations 5 3.1 Pin Configuration 5 3.2 Package Dimensions 6 3.3 Product Architecture 7 4.0 Features of moviNAND 7 4.1 Vendor specific command 7 4.1.1 Boot operation mode7 4.1.2 Boot partition 7 4.1.3 Change boot partition size 8 4.2 Smart Report 9 4.2.1 Smart Rrport Sequence 9 4.
Applications
* where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.