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HW-XX-XX-XX-X-XXXX-SM-X-XXX - HW BOARD-TO-BOARD ASSEMBLY

HW-XX-XX-XX-X-XXXX-SM-X-XXX Description

REVISION AZ DO NOT SCALE FROM THIS PRINT NOTES: 1.C REPRESENTS A CRITICAL DIMENSION.HW-XX-XX-XX-X-XXXX-SM-X-XXX 2.TUBE POSITIONS -05 THRU -36 O.
HW BOARD TO BOARD ASSEMBLY DWG.

HW-XX-XX-XX-X-XXXX-SM-X-XXX Applications

* WITH GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT LEAD STYLE (SEE TABLE 1) IPG@SAMTEC. COM FOR MORE INFORMATION. PLATING SPECIFICATION OPTION #2 POLARIZED POSITION SPECIFY OMITTED PIN OPTION #1 -LC: LOCKING CLIP (SEE FIG 2, SHT 2) (-D: USE RTSM-50-DVU, USE LC-05-TM) 36 02 .195 4.95 REF 3

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BOARD-TO-BOARD ASSEMBLY Samtec
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