* Medium power ratings Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 24 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25
SQ2222AF
Semicoa Semiconductor
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Chip type 2c2222a geometry 0400 polarity npn.
Data Sheet No. 2C2222A
Chip Type 2C2222A Geometry 0400 Polarity NPN
Generic Packaged Parts: 2N2219, 2N2219A, 2N2222, 2N2222A
Chip type 2C2222A by S.
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