SKiiP1092GB170 - intelligent Power PACK halfbridge
SKiiP 1092 GB 170 - 470 WT/FT Absolute Maximum Ratings Symbol Conditions 1) IGBT & Inverse Diode VCES VCC 9) Operating DC link voltage IC Theatsink = 25 °C ICM Tj 3) Visol 4) Theatsink = 25 °C; tp < 1 ms IGBT & Diode AC, 1 min.
IF= IC Theatsink = 25 °C IFM Theatsink = 25 °C; tp < 1 ms IFSM tp = 10 ms; sin.; Tj = 150 °C I2t (Diode) tp = 10 ms; Tj = 150 °C Driver VS1 VS210) dv/dt Top, Tstg Stabilized power supply Nonstabilized power supply Primary to second.
side Operati
SKiiP1092GB170 Features
* Low thermal impedance
* Optimal thermal management with integrated heatsink
* Pressure contact technology with increased power cycling capability, compact design
* Low stray inductance
* High power, small losses
* Overtemp. protection
* Short
