SKiiP1092GB170 Datasheet - Semikron International

SKiiP1092GB170 intelligent Power PACK halfbridge

SKiiP 1092 GB 170 - 470 WT/FT Absolute Maximum Ratings Symbol Conditions 1) IGBT & Inverse Diode VCES VCC 9) Operating DC link voltage IC Theatsink = 25 °C ICM Tj 3) Visol 4) Theatsink = 25 °C; tp < 1 ms IGBT & Diode AC, 1 min. IF= IC Theatsink = 25 °C IFM Theatsink = 25 °C; tp < 1 ms IFSM tp = 10 ms; sin.; Tj = 150 °C I2t (Diode) tp = 10 ms; Tj = 150 °C Driver VS1 VS210) dv/dt Top, Tstg Stabilized power supply Nonstabilized power supply Primary to second. side Operati.

SKiiP1092GB170 Features

* Low thermal impedance

* Optimal thermal management with integrated heatsink

* Pressure contact technology with increased power cycling capability, compact design

* Low stray inductance

* High power, small losses

* Overtemp. protection

* Short

SKiiP1092GB170-SemikronInternational.pdf